
Tribology in chemical mechanical planarization / Hong Liang, David Craven
Tác giả : Hong Liang, David Craven
Nhà xuất bản : Taylor and Francis
Năm xuất bản : 2004
Nơi xuất bản : London
Mô tả vật lý : 185 p. ; 24 cm
ISBN : 0824725670
Số phân loại : 621.9
Chủ đề : 1. Grinding and polishing. 2. Tribology. 3. Động cơ mài mònVật lý ứng dụng.
Thông tin chi tiết
Tóm tắt : | Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology |
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https://lrcopac.ctu.edu.vn/pages/opac/wpid-detailbib-id-97184.html |